Assignee
ISHIKAWA DAI
JP·2 granted patents·3 pending applications·519 citations·filing 2006–2012
Top patents by PatentIndex Score
5 records- 0197US8664627B1Method for supplying gas with flow rate gradient over substrateISHIKAWA DAI·Filed 2012·Granted Mar 4, 2014·518 cites·20 claims
- 0270US8852463B2Metal fine particle for conductive metal paste, conductive metal paste and metal filmISHIKAWA DAI·Filed 2010·Granted Oct 7, 2014·1 cites·18 claims
- 0350US2006275991A1Method of manufacturing a semiconductor integrated circuit deviceISHIKAWA DAI·Filed 2006·Application pending·0 cites
- 0443US2009233429A1Semiconductor device manufacturing method and substrate processing apparatusISHIKAWA DAI·Filed 2007·Application pending·0 cites
- 0542US2011284807A1Metal fine particle, conductive metal paste and metal filmISHIKAWA DAI·Filed 2010·Application pending·0 cites
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