Assignee
ISHIKAWA KENICHI
JP·2 granted patents·12 citations·filing 1982–2009
Top patents by PatentIndex Score
2 records- 0156US8115325B2Semiconductor integrated circuit including plurality of bonding padsISHIKAWA KENICHI·Filed 2009·Granted Feb 14, 2012·1 cites·10 claims
- 0249US4484412AMethod and apparatus for cutting hard and brittle material using system for applying vibration in two directionsISHIKAWA KENICHI·Filed 1982·Granted Nov 27, 1984·11 cites·5 claims
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