Assignee
ISHIKAWA TECH LABORATORY CO LTD
JP·2 granted patents·0 citations·filing 2021–2023
Top patents by PatentIndex Score
2 records- 0167US12392015B2Printed wiring board, printed circuit board, and electronic componentISHIKAWA TECH LABORATORY CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·3 claims
- 0260US11802322B2Method for manufacturing solder product, solder, soldered component, printed wiring board, printed circuit board, wire, soldered product, flexible printed board, electronic component, method for manufacturing tin article, method for manufacturing tin intermediate product, tin intermediate product, and conductive memberISHIKAWA TECH LABORATORY CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·2 claims
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