Assignee
ITO HARUKI
JP·4 granted patents·15 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0194US8294260B2Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatusITO HARUKI·Filed 2011·Granted Oct 23, 2012·12 cites·11 claims
- 0275US8482121B2Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatusITO HARUKI·Filed 2011·Granted Jul 9, 2013·2 cites·9 claims
- 0359US8227878B2Sealed surface acoustic wave element packageITO HARUKI·Filed 2010·Granted Jul 24, 2012·1 cites·7 claims
- 0450US8492856B2Sealed electric element packageITO HARUKI·Filed 2012·Granted Jul 23, 2013·0 cites·5 claims
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