Assignee
IWAMI HIROYUKI
JP·1 granted patent·1 pending application·0 citations·filing 2007–2014
Top patents by PatentIndex Score
2 records- 0142US8865042B2Mold for thermoplastic resin molding, cavity mold, and process for producing the cavity moldIWAMI HIROYUKI·Filed 2007·Granted Oct 21, 2014·0 cites·12 claims
- 0242US2015075701A1Mold for thermoplastic resin molding, cavity mold, and process for producing the cavity moldIWAMI HIROYUKI·Filed 2014·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →