Assignee
IWASHIGE TOMOHITO
JP·2 granted patents·1 pending application·7 citations·filing 2011–2012
Top patents by PatentIndex Score
3 records- 0175US9340700B2Epoxy resin composition for semiconductor encapsulation and semiconductor device using the sameIWASHIGE TOMOHITO·Filed 2012·Granted May 17, 2016·5 cites·5 claims
- 0263US8729715B2Epoxy resin composition for semiconductor encapsulationIWASHIGE TOMOHITO·Filed 2012·Granted May 20, 2014·2 cites·6 claims
- 0335US2012115281A1Method of manufacturing semiconductor deviceIWASHIGE TOMOHITO·Filed 2011·Application pending·0 cites
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