Assignee
JAKOB ANDREAS
DE·3 granted patents·15 citations·filing 2007–2011
Top patents by PatentIndex Score
3 records- 0182US8911583B2Method for processing, in particular, thin rear sides of a wafer, wafer-carrier arrangement and method for producing said type of wafer-carrier arrangementJAKOB ANDREAS·Filed 2007·Granted Dec 16, 2014·9 cites·19 claims
- 0271US9165907B2Method and a system for producing a semi-conductor moduleJAKOB ANDREAS·Filed 2011·Granted Oct 20, 2015·3 cites·22 claims
- 0370US8173522B2Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layerJAKOB ANDREAS·Filed 2009·Granted May 8, 2012·3 cites·12 claims
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