Assignee

JAPAN COPPER DEV ASS

JP·0 granted patents·1 pending application·0 citations·filing 2012–2012

Technology mixC22C1 C22F1 E04B1 E04C1 F16B1 F16M1

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1 record

0143US2013087074A1Copper-based alloy and structural material comprising sameJAPAN COPPER DEV ASS·Filed 2012·Application pending·0 cites

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