Assignee
JAPAN E M CO LTD
JP·4 granted patents·37 citations·filing 1997–2003
Top patents by PatentIndex Score
4 records- 0172US6926188B2Transfer apparatus for arraying small conductive bumps on a substrate and/ or chipJAPAN E M CO LTD·Filed 2003·Granted Aug 9, 2005·15 cites·9 claims
- 0267US6889886B2Transfer apparatus for arraying small conductive bumps on substrate and/ or chipJAPAN E M CO LTD·Filed 2002·Granted May 10, 2005·12 cites·30 claims
- 0341US7119438B2Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor deviceJAPAN E M CO LTD·Filed 2003·Granted Oct 10, 2006·3 cites·12 claims
- 0437US5933239AScale for measuring dimension of article and scale to be used in the sameJAPAN E M CO LTD·Filed 1997·Granted Aug 3, 1999·7 cites·12 claims
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