Assignee
JAPP ROBERT M
US·4 granted patents·4 pending applications·20 citations·filing 2007–2010
Top patents by PatentIndex Score
8 records- 0187US8198551B2Power core for use in circuitized substrate and method of making sameJAPP ROBERT M·Filed 2010·Granted Jun 12, 2012·9 cites·29 claims
- 0274US8084863B2Circuitized substrate with continuous thermoplastic support film dielectric layersJAPP ROBERT M·Filed 2008·Granted Dec 27, 2011·5 cites·13 claims
- 0368US8211790B2Multilayered circuitized substrate with P-aramid dielectric layers and method of making sameJAPP ROBERT M·Filed 2009·Granted Jul 3, 2012·3 cites·6 claims
- 0463US8499440B2Method of making halogen-free circuitized substrate with reduced thermal expansionJAPP ROBERT M·Filed 2009·Granted Aug 6, 2013·3 cites·18 claims
- 0551US2009258161A1Circuitized substrate with P-aramid dielectric layers and method of making sameJAPP ROBERT M·Filed 2009·Application pending·0 cites
- 0647US2008032155A1Drill stack formationJAPP ROBERT M·Filed 2007·Application pending·0 cites
- 0745US2012012553A1Method of forming fibrous laminate chip carrier structuresJAPP ROBERT M·Filed 2010·Application pending·0 cites
- 0837US2011207866A1Halogen-Free Dielectric Composition For use As Dielectric Layer In Circuitized SubstratesJAPP ROBERT M·Filed 2010·Application pending·0 cites
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