Assignee
JCET MAN CO LTD
CN·1 granted patent·13 pending applications·0 citations·filing 2022–2025
Top patents by PatentIndex Score
14 records- 0172US2026096019A1Manufacturing method for a circuit board and circuit boardJCET MAN CO LTD·Filed 2025·Application pending·0 cites
- 0253US2025105224A1Package structure and method for forming sameJCET MAN CO LTD·Filed 2024·Application pending·0 cites
- 0353US2025006685A1Semiconductor packages with multiple types of conductive componentsJCET MAN CO LTD·Filed 2024·Application pending·0 cites
- 0453US2025006585A1Semiconductor packages with multiple types of conductive componentsJCET MAN CO LTD·Filed 2024·Application pending·0 cites
- 0553US2026090420A1Package structure and forming method thereofJCET MAN CO LTD·Filed 2025·Application pending·0 cites
- 0653US2025006682A1Semiconductor packages with multiple types of solder ballsJCET MAN CO LTD·Filed 2024·Application pending·0 cites
- 0752US2025096176A1Packaging structure and packaging methodJCET MAN CO LTD·Filed 2024·Application pending·0 cites
- 0849US2026005104A1Heat dissipation structure and semiconductor package deviceJCET MAN CO LTD·Filed 2025·Application pending·0 cites
- 0949US2025391752A1Package structure and package methodJCET MAN CO LTD·Filed 2025·Application pending·0 cites
- 1048US12519022B2Packaging structure and manufacturing method thereofJCET MAN CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·7 claims
- 1145US2025391753A1Package structure and manufacturing method thereofJCET MAN CO LTD·Filed 2025·Application pending·0 cites
- 1245US2025391759A1Package structure and manufacturing method thereofJCET MAN CO LTD·Filed 2025·Application pending·0 cites
- 1344US2023170274A1Packaging structure and manufacturing method thereofJCET MAN CO LTD·Filed 2022·Application pending·0 cites
- 1438US2025105082A1Packaging structure and method for forming the sameJCET MAN CO LTD·Filed 2024·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →