Assignee
JCET SEMICONDUCTOR SUQIAN CO LTD
CN·1 granted patent·2 pending applications·0 citations·filing 2023–2025
Top patents by PatentIndex Score
3 records- 0156US12456667B2Manufacturing method of semiconductor packaging member, semiconductor packaging member and mounting method thereofJCET SEMICONDUCTOR SUQIAN CO LTD·Filed 2023·Granted Oct 28, 2025·0 cites·13 claims
- 0247US2025316606A1Three-dimensional package structure and method for forming the sameJCET SEMICONDUCTOR SUQIAN CO LTD·Filed 2025·Application pending·0 cites
- 0345US2023411252A1Manufacturing method of semiconductor packaging member, semiconductor packaging member and mounting method thereofJCET SEMICONDUCTOR SUQIAN CO LTD·Filed 2023·Application pending·0 cites
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