Assignee
JEE YOUNG-KUN
KR·2 granted patents·1 pending application·59 citations·filing 2012–2015
Top patents by PatentIndex Score
3 records- 0196US9543276B2Chip-stacked semiconductor packageJEE YOUNG-KUN·Filed 2015·Granted Jan 10, 2017·55 cites·13 claims
- 0275US8742577B2Semiconductor package having an anti-contact layerJEE YOUNG-KUN·Filed 2012·Granted Jun 3, 2014·4 cites·19 claims
- 0338US2012223433A1Semiconductor package including connecting member having controlled content ratio of goldJEE YOUNG-KUN·Filed 2012·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →