Assignee

JI QING

US·1 granted patent·2 citations·filing 2006–2006

Technology mixC08G1 C08K1 C08L1 H05K1 H10W1 Y02P1

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1 record

0147US8075721B2Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkabilityJI QING·Filed 2006·Granted Dec 13, 2011·2 cites·1 claims

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