Assignee
JIANG XIAOHONG
US·4 granted patents·30 citations·filing 2009–2010
Top patents by PatentIndex Score
4 records- 0189US8294259B2Interconnect pattern for transceiver packageJIANG XIAOHONG·Filed 2010·Granted Oct 23, 2012·12 cites·16 claims
- 0287US8841561B1High performance PCBJIANG XIAOHONG·Filed 2010·Granted Sep 23, 2014·9 cites·15 claims
- 0382US8502386B2Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packagesJIANG XIAOHONG·Filed 2010·Granted Aug 6, 2013·6 cites·19 claims
- 0465US9401330B1IC package with non-uniform dielectric layer thicknessJIANG XIAOHONG·Filed 2009·Granted Jul 26, 2016·3 cites·10 claims
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