Assignee
JIANGSU CHANGJIANG ELECTRONICS TECH CO LTD
CN·7 granted patents·2 citations·filing 2013–2021
Top patents by PatentIndex Score
7 records- 0152US11823911B2Process of package-then-etch three-dimensional package structure electrically connected by plated copper pillarsJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·18 claims
- 0251US9627303B2Etching-before-packaging three-dimensional system-level metal circuit board structure inversely provided with chip, and technological methodJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2013·Granted Apr 18, 2017·1 cites·20 claims
- 0350US9640413B2Etching-before-packaging horizontal chip 3D system-level metal circuit board structure and technique thereofJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2013·Granted May 2, 2017·1 cites·19 claims
- 0446US11784063B2Packaging method and packaging device for selectively encapsulating packaging structureJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2019·Granted Oct 10, 2023·0 cites·4 claims
- 0541US11217459B2Package-before-etch three-dimensional package structure electrically connected by plated copper pillars and process thereofJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2017·Granted Jan 4, 2022·0 cites·8 claims
- 0633US9633985B2First-etched and later-packaged three-dimensional system-in-package normal chip stack package structure and processing method thereofJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2014·Granted Apr 25, 2017·0 cites·10 claims
- 0728US10763128B2Process of surface-mounting three-dimensional package structure electrically connected by prepackaged metalJIANGSU CHANGJIANG ELECTRONICS TECH CO LTD·Filed 2017·Granted Sep 1, 2020·0 cites·8 claims
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