Assignee
JO SEUNG HEE
KR·2 granted patents·3 pending applications·7 citations·filing 2011–2012
Technology mixH10W5
Top patents by PatentIndex Score
5 records- 0176US8592952B2Semiconductor chip and semiconductor package with stack chip structureJO SEUNG HEE·Filed 2011·Granted Nov 26, 2013·7 cites·15 claims
- 0244US8609535B2Semiconductor package having through electrodes that reduce leakage current and method for manufacturing the sameJO SEUNG HEE·Filed 2011·Granted Dec 17, 2013·0 cites·18 claims
- 0331US2012129341A1Method for fabricating via hole and through-silicon viaJO SEUNG HEE·Filed 2011·Application pending·0 cites
- 0428US2013292818A1Semiconductor chip, semiconductor package having the same, and stacked semiconductor package using the semiconductor packageJO SEUNG HEE·Filed 2012·Application pending·0 cites
- 0526US2012273940A1Semiconductor apparatus and method for fabricating the sameJO SEUNG HEE·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →