Assignee
JOHNSON HALE
US·2 granted patents·1 pending application·25 citations·filing 2008–2015
Top patents by PatentIndex Score
3 records- 0190US8181688B2Apparatus for temporary wafer bonding and debondingJOHNSON HALE·Filed 2010·Granted May 22, 2012·25 cites·16 claims
- 0251US8088684B2Apparatus and method for semiconductor wafer bumping via injection molded solderJOHNSON HALE·Filed 2008·Granted Jan 3, 2012·0 cites·32 claims
- 0331US2015206783A1System amd method for substrate holdingJOHNSON HALE·Filed 2015·Application pending·0 cites
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