Assignee
JUNG JAE-MIN
KR·2 granted patents·9 citations·filing 2015–2015
Top patents by PatentIndex Score
2 records- 0185US9818732B2Chip-on-film package and device assembly including the sameJUNG JAE-MIN·Filed 2015·Granted Nov 14, 2017·6 cites·13 claims
- 0275US9922921B2Tape wiring substrate, semiconductor package, and display apparatus including semiconductor packageJUNG JAE MIN·Filed 2015·Granted Mar 20, 2018·3 cites·20 claims
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