Assignee
JWL ZHEJIANG SEMICONDUCTOR CO LTD
CN·5 granted patents·7 pending applications·0 citations·filing 2020–2023
Top patents by PatentIndex Score
12 records- 0155US11742824B2Bulk acoustic resonator with heat dissipation structure and fabrication processJWL ZHEJIANG SEMICONDUCTOR CO LTD·Filed 2020·Granted Aug 29, 2023·0 cites·10 claims
- 0252US11901872B2Thin film bulk acoustic resonator and manufacturing process thereforJWL ZHEJIANG SEMICONDUCTOR CO LTD·Filed 2020·Granted Feb 13, 2024·0 cites·16 claims
- 0350US11695386B2Solidly mounted resonator having electromagnetic shielding structure, and manufacturing processJWL ZHEJIANG SEMICONDUCTOR CO LTD·Filed 2020·Granted Jul 4, 2023·0 cites·20 claims
- 0450US2025088173A1Resonator, resonator assembly, filter, electronic device, method for fabricating resonator and packaging structureJWL ZHEJIANG SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 0548US2025080081A1Bulk acoustic resonator and method for manufacturing the same, filter and electronic deviceJWL ZHEJIANG SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 0648US2024429892A1Bulk acoustic resonator and related device, and method for manufacturing bulk acoustic resonatorJWL ZHEJIANG SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 0747US2025088174A1Resonator, resonator assembly, filter, electronic device and method for manufacturing resonatorJWL ZHEJIANG SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 0847US2024372527A1Resonator, filter, electronic device, and method for manufacturing resonatorJWL ZHEJIANG SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 0947US2024275358A1Bulk acoustic resonator, resonator assembly, filter, and electronic deviceJWL ZHEJIANG SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 1047US2024267019A1Bulk acoustic resonator and manufacturing method thereof, filter and electronic deviceJWL ZHEJIANG SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 1143US12166469B2Cavity structure of bulk acoustic resonator, and manufacturing processJWL ZHEJIANG SEMICONDUCTOR CO LTD·Filed 2020·Granted Dec 10, 2024·0 cites·12 claims
- 1242US11177141B2Method for packaging a chipJWL ZHEJIANG SEMICONDUCTOR CO LTD·Filed 2020·Granted Nov 16, 2021·0 cites·6 claims
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