Assignee

KAI TOMOKI

JP·1 granted patent·0 citations·filing 2022–2022

Technology mixB22F1 B29C1 B33Y1 Y02P1

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0150US12109614B2Layer forming apparatus, method of forming powder layer, and recording mediumKAI TOMOKI·Filed 2022·Granted Oct 8, 2024·0 cites·9 claims

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