Assignee
KAMIYAMA EIJI
JP·3 granted patents·5 citations·filing 2009–2011
Top patents by PatentIndex Score
3 records- 0171US8284395B2Wafer surface measuring apparatusKAMIYAMA EIJI·Filed 2010·Granted Oct 9, 2012·3 cites·10 claims
- 0260US8339593B2System and method of two-stepped laser scattering defect inspectionKAMIYAMA EIJI·Filed 2009·Granted Dec 25, 2012·1 cites·6 claims
- 0353US8761488B2Image data processing method and image creating methodKAMIYAMA EIJI·Filed 2011·Granted Jun 24, 2014·1 cites·3 claims
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