Assignee
KANTO SANYO SEMICONDUCTORS CO
JP·20 granted patents·5 pending applications·212 citations·filing 2003–2005
Top patents by PatentIndex Score
25 records- 0187US7183589B2Semiconductor device with a resin-sealed optical semiconductor elementKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Granted Feb 27, 2007·44 cites·3 claims
- 0283US7030501B2Semiconductor device and switching elementKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Granted Apr 18, 2006·47 cites·9 claims
- 0370US6987030B2Method of manufacturing semiconductor deviceKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Granted Jan 17, 2006·11 cites·5 claims
- 0467US7053492B2Circuit device and method of manufacturing the sameKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted May 30, 2006·14 cites·18 claims
- 0563US7264997B2Semiconductor device including inclined cut surface and manufacturing method thereofKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Granted Sep 4, 2007·12 cites·31 claims
- 0663US7075188B2Circuit device and method for manufacturing the sameKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Granted Jul 11, 2006·12 cites·6 claims
- 0763US6953712B2Circuit device manufacturing methodKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted Oct 11, 2005·9 cites·13 claims
- 0861US7102211B2Semiconductor device and hybrid integrated circuit deviceKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Granted Sep 5, 2006·12 cites·12 claims
- 0961US7030033B2Method for manufacturing circuit devicesKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted Apr 18, 2006·9 cites·25 claims
- 1057US6949470B2Method for manufacturing circuit devicesKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted Sep 27, 2005·7 cites·9 claims
- 1156US7064046B2Manufacturing method of semiconductor deviceKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Granted Jun 20, 2006·8 cites·12 claims
- 1254US6919624B2Semiconductor device with exposed electrodesKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted Jul 19, 2005·6 cites·17 claims
- 1353US7056768B2Cutting method and method of manufacturing semiconductor deviceKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Granted Jun 6, 2006·6 cites·14 claims
- 1450US6998701B2Resin sealing-type semiconductor device and method for manufacturing the sameKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Granted Feb 14, 2006·3 cites·5 claims
- 1547US7213333B2Method for manufacturing mounting substrate and method for manufacturing circuit deviceKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Granted May 8, 2007·3 cites·16 claims
- 1647US7105384B2Circuit device manufacturing method including mounting circuit elements on a conductive foil, forming separation grooves in the foil, and etching the rear of the foilKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted Sep 12, 2006·2 cites·13 claims
- 1747US7045393B2Method for manufacturing circuit devicesKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted May 16, 2006·2 cites·19 claims
- 1847US6946724B2Circuit device and method of manufacture thereofKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted Sep 20, 2005·3 cites·12 claims
- 1945US7152316B2Hybrid integrated circuit device and method of manufacturing the sameKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Granted Dec 26, 2006·2 cites·7 claims
- 2043US2006065421A1Circuit device and manufacturing method thereofKANTO SANYO SEMICONDUCTORS CO·Filed 2005·Application pending·0 cites
- 2141US2007035020A1Semiconductor Apparatus and Semiconductor ModuleKANTO SANYO SEMICONDUCTORS CO·Filed 2005·Application pending·0 cites
- 2236US6972477B2Circuit device with conductive patterns separated by insulating resin-filled groovesKANTO SANYO SEMICONDUCTORS CO·Filed 2003·Granted Dec 6, 2005·0 cites·14 claims
- 2335US2005161782A1Hybrid integrated circuit device and manufacturing method of the sameKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Application pending·0 cites
- 2435US2005161781A1Hybrid integrated circuit device and manufacturing method thereofKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Application pending·0 cites
- 2535US2007090521A1Circuit device and method of manufacturing the sameKANTO SANYO SEMICONDUCTORS CO·Filed 2004·Application pending·0 cites
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