Assignee
KARNEZOS MARCOS
US·4 granted patents·55 citations·filing 2004–2009
Top patents by PatentIndex Score
4 records- 0186US8970049B2Multiple chip package module having inverted package stacked over dieKARNEZOS MARCOS·Filed 2004·Granted Mar 3, 2015·42 cites·49 claims
- 0286US8143100B2Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packagesKARNEZOS MARCOS·Filed 2007·Granted Mar 27, 2012·11 cites·6 claims
- 0366US8410596B2Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array packageKARNEZOS MARCOS·Filed 2008·Granted Apr 2, 2013·2 cites·30 claims
- 0455US8994162B2Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array packageKARNEZOS MARCOS·Filed 2009·Granted Mar 31, 2015·0 cites·30 claims
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