Assignee
KATAYAMA MASAYA
JP·3 granted patents·1 pending application·7 citations·filing 2010–2013
Top patents by PatentIndex Score
4 records- 0187US8410533B2Semiconductor device and method for producing sameKATAYAMA MASAYA·Filed 2010·Granted Apr 2, 2013·5 cites·12 claims
- 0276US8409913B2Semiconductor device and method for producing sameKATAYAMA MASAYA·Filed 2012·Granted Apr 2, 2013·1 cites·4 claims
- 0356US8686499B2Semiconductor deviceKATAYAMA MASAYA·Filed 2011·Granted Apr 1, 2014·1 cites·10 claims
- 0440US2015107764A1Process for producing adhesive sheet having singulated adhesive layer, process for producing wiring substrate using the adhesive sheet, method of manufacturing semiconductor equipment, and equipment for producing adhesive sheetKATAYAMA MASAYA·Filed 2013·Application pending·0 cites
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