Assignee
KATO HIDETO
JP·2 granted patents·8 citations·filing 2011–2012
Top patents by PatentIndex Score
2 records- 0186US8785114B2Method for manufacturing micro-structureKATO HIDETO·Filed 2011·Granted Jul 22, 2014·4 cites·8 claims
- 0276US9653335B2Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing methodKATO HIDETO·Filed 2012·Granted May 16, 2017·4 cites·7 claims
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