Assignee

KATOU RIE

JP·1 granted patent·6 citations·filing 2011–2011

Technology mixC09J1 H01L1 H10P1 H10W1 Y10T1

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0177US8975161B2Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing methodKATOU RIE·Filed 2011·Granted Mar 10, 2015·6 cites·10 claims

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