Assignee

KATZ AVISHAY

US·1 granted patent·81 citations·filing 1991–1991

Technology mixB23K1 H01S1 H10W1 Y10T1

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0189US5197654ABonding method using solder composed of multiple alternating gold and tin layersKATZ AVISHAY·Filed 1991·Granted Mar 30, 1993·81 cites·14 claims

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