Assignee
KAWAMORI TAKASHI
JP·5 granted patents·2 pending applications·6 citations·filing 2009–2012
Top patents by PatentIndex Score
7 records- 0176US8323873B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted Dec 4, 2012·2 cites·21 claims
- 0276US8293453B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted Oct 23, 2012·2 cites·9 claims
- 0375US8445177B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted May 21, 2013·2 cites·14 claims
- 0457US8673539B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2012·Granted Mar 18, 2014·0 cites·4 claims
- 0553US8278024B2Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic partKAWAMORI TAKASHI·Filed 2010·Granted Oct 2, 2012·0 cites·20 claims
- 0646US2011159238A1Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic componentKAWAMORI TAKASHI·Filed 2009·Application pending·0 cites
- 0746US2011223397A1Semiconductor device and method for manufacturing the sameKAWAMORI TAKASHI·Filed 2009·Application pending·0 cites
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