Assignee
KHAN REZAUR RAHMAN
US·6 granted patents·1 pending application·162 citations·filing 2006–2012
Top patents by PatentIndex Score
7 records- 0199US8508045B2Package 3D interconnection and method of making sameKHAN REZAUR RAHMAN·Filed 2011·Granted Aug 13, 2013·88 cites·22 claims
- 0297US8558395B2Organic interface substrate having interposer with through-semiconductor viasKHAN REZAUR RAHMAN·Filed 2012·Granted Oct 15, 2013·38 cites·13 claims
- 0387US8269323B2Integrated circuit package with etched leadframe for package-on-package interconnectsKHAN REZAUR RAHMAN·Filed 2009·Granted Sep 18, 2012·13 cites·20 claims
- 0483US9548251B2Semiconductor interposer having a cavity for intra-interposer dieKHAN REZAUR RAHMAN·Filed 2012·Granted Jan 17, 2017·7 cites·28 claims
- 0583US8183687B2Interposer for die stacking in semiconductor packages and the method of making the sameKHAN REZAUR RAHMAN·Filed 2007·Granted May 22, 2012·11 cites·24 claims
- 0674US9299634B2Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packagesKHAN REZAUR RAHMAN·Filed 2006·Granted Mar 29, 2016·5 cites·24 claims
- 0739US2012187545A1Direct through via wafer level fanout packageKHAN REZAUR RAHMAN·Filed 2011·Application pending·0 cites
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