Assignee
KIM JAE MYUN
KR·1 granted patent·3 pending applications·12 citations·filing 2005–2010
Technology mixH10W4
Top patents by PatentIndex Score
4 records- 0186US8390114B2Semiconductor packageKIM JAE MYUN·Filed 2010·Granted Mar 5, 2013·12 cites·12 claims
- 0240US2009065924A1Semiconductor package with reduced volume and signal transfer pathKIM JAE MYUN·Filed 2008·Application pending·0 cites
- 0339US2008054434A1Semiconductor stack package for optimal packaging of components having interconnectionsKIM JAE MYUN·Filed 2007·Application pending·0 cites
- 0431US2006284298A1Chip stack package having same length bonding leadsKIM JAE MYUN·Filed 2005·Application pending·0 cites
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