Assignee
KINSUS INTERCONNECT TECH CORP
TW·58 granted patents·21 pending applications·146 citations·filing 2003–2024
Top patents by PatentIndex Score
79 records- 0189US9831167B1Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Nov 28, 2017·7 cites·18 claims
- 0288US9439290B1Carrier board structureKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Sep 6, 2016·7 cites·4 claims
- 0388US9301405B1Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-holeKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Mar 29, 2016·10 cites·7 claims
- 0486US9439292B1Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structureKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Sep 6, 2016·9 cites·10 claims
- 0585US9198296B1Double sided board with buried element and method for manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Nov 24, 2015·7 cites·8 claims
- 0683US9901016B1Electromagnetic-interference shielding deviceKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Feb 20, 2018·3 cites·7 claims
- 0780US6759318B1Translation pad flip chip (TPFC) method for improving micro bump pitch IC substrate structure and manufacturing processKINSUS INTERCONNECT TECH CORP·Filed 2003·Granted Jul 6, 2004·32 cites·4 claims
- 0878US9847165B2Winged coil structure and method of manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Dec 19, 2017·2 cites·20 claims
- 0976US8051558B2Manufacturing method of the embedded passive deviceKINSUS INTERCONNECT TECH CORP·Filed 2008·Granted Nov 8, 2011·5 cites·6 claims
- 1076US7875809B2Method of fabricating board having high density core layer and structure thereofKINSUS INTERCONNECT TECH CORP·Filed 2007·Granted Jan 25, 2011·8 cites·1 claims
- 1175US9406641B2Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2013·Granted Aug 2, 2016·3 cites·8 claims
- 1273US7768131B1Package structure preventing solder overflow on substrate solder padsKINSUS INTERCONNECT TECH CORP·Filed 2009·Granted Aug 3, 2010·8 cites·12 claims
- 1372US10440837B2Manufacturing method of double layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Oct 8, 2019·1 cites·10 claims
- 1472US8377815B2Manufacturing method of a semiconductor load boardKINSUS INTERCONNECT TECH CORP·Filed 2011·Granted Feb 19, 2013·4 cites·12 claims
- 1571US10383265B2Electromagnetic-interference shielding deviceKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Aug 13, 2019·1 cites·9 claims
- 1671US7405146B2Electroplating method by transmitting electric current from a ball sideKINSUS INTERCONNECT TECH CORP·Filed 2006·Granted Jul 29, 2008·6 cites·7 claims
- 1767US7353591B2Method of manufacturing coreless substrateKINSUS INTERCONNECT TECH CORP·Filed 2006·Granted Apr 8, 2008·5 cites·4 claims
- 1866US7871892B2Method for fabricating buried capacitor structureKINSUS INTERCONNECT TECH CORP·Filed 2009·Granted Jan 18, 2011·3 cites·3 claims
- 1965US10334719B2Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Jun 25, 2019·1 cites·18 claims
- 2065US8547548B1Final defect inspection systemKINSUS INTERCONNECT TECH CORP·Filed 2012·Granted Oct 1, 2013·1 cites·16 claims
- 2164US10779418B2Manufacturing method of double layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Sep 15, 2020·0 cites·18 claims
- 2263US10039185B2Manufacturing method of landless multilayer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Jul 31, 2018·1 cites·10 claims
- 2363US7488675B2Method for fabricating IC board without ring structureKINSUS INTERCONNECT TECH CORP·Filed 2007·Granted Feb 10, 2009·2 cites·4 claims
- 2462US10366822B2Method of manufacturing winged coil structureKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Jul 30, 2019·0 cites·15 claims
- 2562US10170403B2Ameliorated compound carrier board structure of flip-chip chip-scale packageKINSUS INTERCONNECT TECH CORP·Filed 2014·Granted Jan 1, 2019·2 cites·8 claims
- 2662US2025393119A1Anti-warpage carrierKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 2762US2025393123A1Impact-resistant reinforced carrierKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 2862US2025389754A1Test fixtureKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 2961US7805835B2Method for selectively processing surface tension of solder mask layer in circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2008·Granted Oct 5, 2010·3 cites·2 claims
- 3060US10256030B2Flexible plate adapted to be used in winged coil structure, winged coil structure, and method of manufacturing winged coil structureKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Apr 9, 2019·0 cites·9 claims
- 3160US6969674B2Structure and method for fine pitch flip chip substrateKINSUS INTERCONNECT TECH CORP·Filed 2004·Granted Nov 29, 2005·12 cites·14 claims
- 3260US2025247954A1Micro circuit structure and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 3360US2025079333A1Anti-warpage reinforced carrierKINSUS INTERCONNECT TECH CORP·Filed 2023·Application pending·0 cites
- 3459US11495390B2Buildup board structureKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Nov 8, 2022·0 cites·10 claims
- 3558US10104817B1Electromagnetic-interference shielding device and method for manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Oct 16, 2018·0 cites·11 claims
- 3657US11044806B2Method for manufacturing multi-layer circuit board capable of being applied with electrical testingKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Jun 22, 2021·0 cites·20 claims
- 3757US10779405B2Landless multilayer circuit board and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Sep 15, 2020·0 cites·11 claims
- 3857US7662662B2Method for manufacturing carrier substrateKINSUS INTERCONNECT TECH CORP·Filed 2007·Granted Feb 16, 2010·2 cites·4 claims
- 3957US7573721B2Embedded passive device structure and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2007·Granted Aug 11, 2009·1 cites·7 claims
- 4056US10440836B2Double layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Oct 8, 2019·0 cites·3 claims
- 4156US10405423B2Multi-layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Sep 3, 2019·0 cites·14 claims
- 4254US9967975B2Multi-layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted May 8, 2018·0 cites·13 claims
- 4352US10548214B2Multi-layer circuit board capable of being applied with electrical testing and method for manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Jan 28, 2020·0 cites·20 claims
- 4452US10256028B2Buildup board structureKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Apr 9, 2019·0 cites·10 claims
- 4551US9095084B2Stacked multilayer structureKINSUS INTERCONNECT TECH CORP·Filed 2013·Granted Jul 28, 2015·0 cites·4 claims
- 4650US10455694B2Method for manufacturing a multi-layer circuit board capable of being applied with electrical testingKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Oct 22, 2019·0 cites·20 claims
- 4750US9370110B2Method of manufacturing a multilayer substrate structure for fine lineKINSUS INTERCONNECT TECH CORP·Filed 2014·Granted Jun 14, 2016·0 cites·7 claims
- 4850US2025318016A1Temperature control and detection systemKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 4950US2015282306A1Multilayer substrate structure for fine lineKINSUS INTERCONNECT TECH CORP·Filed 2014·Application pending·0 cites
- 5049US9095085B2Method of manufacturing a stacked multilayer structureKINSUS INTERCONNECT TECH CORP·Filed 2013·Granted Jul 28, 2015·0 cites·8 claims
Showing the top 50 of 79 patent records by PatentIndex Score.
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