Assignee
KITADA TOMOFUMI
JP·2 granted patents·0 citations·filing 2010–2010
Technology mixH05K2
Top patents by PatentIndex Score
2 records- 0147US8492657B2Printed wiring board, method for forming the printed wiring board, and board interconnection structureKITADA TOMOFUMI·Filed 2010·Granted Jul 23, 2013·0 cites·3 claims
- 0247US8222531B2Printed wiring board, method for forming the printed wiring board, and board interconnection structureKITADA TOMOFUMI·Filed 2010·Granted Jul 17, 2012·0 cites·2 claims
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