Assignee
KITAE TAKASHI
JP·4 granted patents·1 pending application·10 citations·filing 2005–2011
Top patents by PatentIndex Score
5 records- 0181US8283246B2Flip chip mounting method and bump forming methodKITAE TAKASHI·Filed 2011·Granted Oct 9, 2012·4 cites·7 claims
- 0271US8501583B2Method for connecting between substrates, flip-chip mounting structure, and connection structure between substratesKITAE TAKASHI·Filed 2009·Granted Aug 6, 2013·5 cites·11 claims
- 0359US9426899B2Electronic component assemblyKITAE TAKASHI·Filed 2008·Granted Aug 23, 2016·1 cites·7 claims
- 0448US2009008776A1Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing MethodKITAE TAKASHI·Filed 2007·Application pending·0 cites
- 0541US8709293B2Flip-chip mounting resin composition and bump forming resin compositionKITAE TAKASHI·Filed 2005·Granted Apr 29, 2014·0 cites·17 claims
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