Assignee

KO DONGKYUN

KR·2 granted patents·78 citations·filing 2009–2011

Technology mixH05K2 H10P2 H10W2

Top patents by PatentIndex Score

2 records

0192US8093690B2Chip package and manufacturing method thereofKO DONGKYUN·Filed 2009·Granted Jan 10, 2012·63 cites·18 claims
0289US8592958B2Chip package and manufacturing method thereofKO DONGKYUN·Filed 2011·Granted Nov 26, 2013·15 cites·20 claims

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