Assignee
KO WONJUN
KR·7 granted patents·44 citations·filing 2007–2013
Top patents by PatentIndex Score
7 records- 0190US8536718B2Integrated circuit packaging system with trenches and method of manufacture thereofKO WONJUN·Filed 2010·Granted Sep 17, 2013·16 cites·28 claims
- 0281US8609463B2Integrated circuit package system employing multi-package module techniquesKO WONJUN·Filed 2007·Granted Dec 17, 2013·11 cites·18 claims
- 0378US9076802B1Dual-sided film-assist molding processKO WONJUN·Filed 2013·Granted Jul 7, 2015·6 cites·18 claims
- 0477US8546957B2Integrated circuit packaging system with dielectric support and method of manufacture thereofKO WONJUN·Filed 2010·Granted Oct 1, 2013·5 cites·20 claims
- 0576US8569882B2Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereofKO WONJUN·Filed 2011·Granted Oct 29, 2013·5 cites·17 claims
- 0656US8618653B2Integrated circuit package system with wafer scale heat slugKO WONJUN·Filed 2008·Granted Dec 31, 2013·1 cites·20 claims
- 0744US8067275B2Integrated circuit package system with package integrationKO WONJUN·Filed 2007·Granted Nov 29, 2011·0 cites·20 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →