Assignee
KOIDE SHOHEI
US·11 granted patents·1 pending application·152 citations·filing 2001–2012
Top patents by PatentIndex Score
12 records- 0198US8258265B2Reconstituted polypeptidesKOIDE SHOHEI·Filed 2007·Granted Sep 4, 2012·60 cites·13 claims
- 0296US8263741B2Artificial antibody polypeptidesKOIDE SHOHEI·Filed 2001·Granted Sep 11, 2012·57 cites·29 claims
- 0391US8106162B2Artificial antibody polypeptidesKOIDE SHOHEI·Filed 2007·Granted Jan 31, 2012·7 cites·14 claims
- 0491US8062858B2Artificial antibody polypeptidesKOIDE SHOHEI·Filed 2006·Granted Nov 22, 2011·7 cites·19 claims
- 0584US9413732B2Vehicle network systemKOIDE SHOHEI·Filed 2012·Granted Aug 9, 2016·9 cites·12 claims
- 0683US8263350B2Molecular affinity clamp technology and uses thereofKOIDE SHOHEI·Filed 2010·Granted Sep 11, 2012·5 cites·20 claims
- 0781US9051357B2Reconstituted polypeptidesKOIDE SHOHEI·Filed 2012·Granted Jun 9, 2015·2 cites·9 claims
- 0880US9885050B2Molecular affinity clamp technology and uses thereofKOIDE SHOHEI·Filed 2008·Granted Feb 6, 2018·4 cites·17 claims
- 0980US9127090B2Artificial antibody polypeptidesKOIDE SHOHEI·Filed 2011·Granted Sep 8, 2015·1 cites·21 claims
- 1060US2013267676A1Artificial antibody polypeptidesKOIDE SHOHEI·Filed 2012·Application pending·0 cites
- 1143US8727495B2Liquid droplet discharge apparatus, piezoelectric actuator, and method for producing liquid droplet discharge apparatusKOIDE SHOHEI·Filed 2012·Granted May 20, 2014·0 cites·10 claims
- 1241US8927874B2Flexible wiring substrate, method for assembling flexible wiring substrate, and method for manufacturing liquid jetting apparatusKOIDE SHOHEI·Filed 2012·Granted Jan 6, 2015·0 cites·8 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →