Assignee
KOIZUMI NAOYUKI
JP·4 granted patents·2 pending applications·80 citations·filing 2006–2012
Top patents by PatentIndex Score
6 records- 0196US8120166B2Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the sameKOIZUMI NAOYUKI·Filed 2009·Granted Feb 21, 2012·68 cites·9 claims
- 0280US8692363B2Electric part package and manufacturing method thereofKOIZUMI NAOYUKI·Filed 2011·Granted Apr 8, 2014·6 cites·7 claims
- 0373US8111954B2Module substrate including optical transmission mechanism and method of producing the sameKOIZUMI NAOYUKI·Filed 2009·Granted Feb 7, 2012·6 cites·12 claims
- 0441US8659127B2Wiring substrate, semiconductor device and manufacturing method thereofKOIZUMI NAOYUKI·Filed 2012·Granted Feb 25, 2014·0 cites·11 claims
- 0539US2007029562A1Semiconductor device and method of manufacturing a semiconductor deviceKOIZUMI NAOYUKI·Filed 2006·Application pending·0 cites
- 0638US2012119391A1Semiconductor package and manufacturing method thereofKOIZUMI NAOYUKI·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when KOIZUMI NAOYUKI files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →