Assignee
KOKUSAI ELECTRIC CORP
JP·524 granted patents·495 pending applications·973 citations·filing 2016–2025
Top patents by PatentIndex Score
1,019 records- 0199US11629408B2Plasma generation device, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Apr 18, 2023·8 cites·14 claims
- 0298US11469083B2Plasma generating device, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Oct 11, 2022·4 cites·17 claims
- 0397US11967490B2Plasma generating device, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 23, 2024·2 cites·17 claims
- 0497US11538661B1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Granted Dec 27, 2022·3 cites·19 claims
- 0597US11322370B1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted May 3, 2022·3 cites·20 claims
- 0697US11145505B1Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Oct 12, 2021·5 cites·23 claims
- 0796US12123091B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Oct 22, 2024·2 cites·10 claims
- 0896US12094735B2Substrate processing apparatus, plurality of electrodes and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Sep 17, 2024·2 cites·19 claims
- 0996US11728183B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Aug 15, 2023·2 cites·20 claims
- 1096US11574815B1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Feb 7, 2023·7 cites·20 claims
- 1196US11555246B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jan 17, 2023·5 cites·22 claims
- 1296US11527402B2Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Dec 13, 2022·4 cites·20 claims
- 1396US11473196B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2020·Granted Oct 18, 2022·4 cites·20 claims
- 1496US11417518B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 1596US11177143B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 16, 2021·5 cites·20 claims
- 1696US11158501B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Oct 26, 2021·4 cites·20 claims
- 1796US10590531B1Substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 17, 2020·338 cites·10 claims
- 1896US10424520B1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Sep 24, 2019·15 cites·9 claims
- 1995US11967534B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 23, 2024·3 cites·20 claims
- 2095US11749510B2Plasma generating device, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Sep 5, 2023·2 cites·19 claims
- 2195US11685993B2Method of cleaning reaction tube, method of manufacturing semiconductor device, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jun 27, 2023·3 cites·9 claims
- 2295US11396700B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 26, 2022·4 cites·13 claims
- 2395US11261528B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Mar 1, 2022·5 cites·5 claims
- 2495US2026081115A1Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2595US2026068558A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2694US12050138B2Substrate processing apparatus, and thermocoupleKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 30, 2024·2 cites·20 claims
- 2794US11923193B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Mar 5, 2024·3 cites·22 claims
- 2894US11905596B2Method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 20, 2024·2 cites·12 claims
- 2994US11542603B2Substrate processing apparatus, method of manufacturing semiconductor device and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jan 3, 2023·2 cites·16 claims
- 3094US11101111B2Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 24, 2021·3 cites·12 claims
- 3194US10636681B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2018·Granted Apr 28, 2020·6 cites·17 claims
- 3294US10593572B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 17, 2020·9 cites·7 claims
- 3394US2026082833A1Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3494US2026033256A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3594US2026047168A1Method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 3693US11935762B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Mar 19, 2024·3 cites·14 claims
- 3793US11935742B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Mar 19, 2024·1 cites·21 claims
- 3893US11869764B2Substrate processing apparatus, substrate processing method and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jan 9, 2024·1 cites·15 claims
- 3993US11387152B1Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 12, 2022·2 cites·14 claims
- 4093US11257699B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Feb 22, 2022·4 cites·10 claims
- 4193US10825697B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 3, 2020·3 cites·10 claims
- 4293US10770287B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Sep 8, 2020·6 cites·18 claims
- 4393US10731254B2Protective plate, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 4, 2020·3 cites·10 claims
- 4492US11705325B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jul 18, 2023·1 cites·21 claims
- 4592US10453735B2Substrate processing apparatus, reaction tube, semiconductor device manufacturing method, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 22, 2019·8 cites·5 claims
- 4692US2026096360A1Substrate processing apparatus, recording medium, method of processing substrate, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4791US11784044B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Oct 10, 2023·1 cites·21 claims
- 4891US11515143B2Method of manufacturing semiconductor device, substrate processing apparatus, recording medium, and method of processing substrateKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 29, 2022·2 cites·22 claims
- 4991US11469081B2Plasma generating device, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Oct 11, 2022·4 cites·14 claims
- 5091US11251039B2Method of manufacturing semiconductor device, recording medium, and substrate processing methodKOKUSAI ELECTRIC CORP·Filed 2020·Granted Feb 15, 2022·2 cites·21 claims
Showing the top 50 of 1,019 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when KOKUSAI ELECTRIC CORP files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →