Assignee
KOMEDA KENJI
JP·2 granted patents·4 citations·filing 2007–2010
Top patents by PatentIndex Score
2 records- 0166US8124493B2Method of manufacturing a semiconductor device having an electrode exposed through a holeKOMEDA KENJI·Filed 2010·Granted Feb 28, 2012·3 cites·20 claims
- 0256US8586430B2Method of forming dielectric film and capacitor manufacturing method using the sameKOMEDA KENJI·Filed 2007·Granted Nov 19, 2013·1 cites·19 claims
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