Assignee

KOMIYAMA ELECTROC CORP

JP·1 granted patent·0 citations·filing 2023–2023

Technology mixC08J1 C23C1 H01J1 H05K1 H10P1

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1 record

0162US12540223B2Resin surface hydrophilization method, plasma processing device, laminate body, and laminate body manufacturing methodresin surface hydrophilization method, plasma processing device, laminate body, an laminate body manufacturing methodKOMIYAMA ELECTROC CORP·Filed 2023·Granted Feb 3, 2026·0 cites·4 claims

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