Assignee
KONG BOB
US·4 granted patents·1 pending application·12 citations·filing 2008–2012
Top patents by PatentIndex Score
5 records- 0182US8859427B2Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processingKONG BOB·Filed 2011·Granted Oct 14, 2014·4 cites·3 claims
- 0281US8545998B2Electroless deposition of platinum on copperKONG BOB·Filed 2011·Granted Oct 1, 2013·4 cites·15 claims
- 0374US8728879B2Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processingKONG BOB·Filed 2012·Granted May 20, 2014·2 cites·18 claims
- 0470US8143164B2Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processingKONG BOB·Filed 2009·Granted Mar 27, 2012·2 cites·4 claims
- 0555US2010055422A1Electroless Deposition of Platinum on CopperKONG BOB·Filed 2008·Application pending·0 cites
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