Assignee
KOTAKE TOMOHIKO
JP·2 granted patents·1 pending application·1 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0167US9079376B2Prepreg, laminate obtained with the same and printed-wiring boardKOTAKE TOMOHIKO·Filed 2012·Granted Jul 14, 2015·1 cites·22 claims
- 0248US2012077401A1Resin composition for production of clad layer, resin film for production of clad layer utilizing the resin composition, and optical waveguide and optical module each utilizing the resin composition or the resin filmKOTAKE TOMOHIKO·Filed 2010·Application pending·0 cites
- 0341US11401381B2Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using sameKOTAKE TOMOHIKO·Filed 2012·Granted Aug 2, 2022·0 cites·17 claims
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