Assignee
KU YI-SHA
TW·3 granted patents·1 pending application·11 citations·filing 2009–2011
Top patents by PatentIndex Score
4 records- 0179US8699021B2System, method and computer readable medium for through silicon via structure measurementKU YI SHA·Filed 2011·Granted Apr 15, 2014·5 cites·17 claims
- 0274US8321821B2Method for designing two-dimensional array overlay targets and method and system for measuring overlay errors using the sameKU YI SHA·Filed 2009·Granted Nov 27, 2012·4 cites·8 claims
- 0364US8139233B2System and method for via structure measurementKU YI SHA·Filed 2010·Granted Mar 20, 2012·2 cites·21 claims
- 0435US2012290239A1Thin metal film measurement methodKU YI-SHA·Filed 2011·Application pending·0 cites
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