Assignee
KUAN HEAP HOE
SG·10 granted patents·1 pending application·23 citations·filing 2005–2011
Top patents by PatentIndex Score
11 records- 0182US8258612B2Encapsulant interposer system with integrated passive devices and manufacturing method thereforKUAN HEAP HOE·Filed 2010·Granted Sep 4, 2012·5 cites·19 claims
- 0273US8536692B2Mountable integrated circuit package system with mountable integrated circuit dieKUAN HEAP HOE·Filed 2007·Granted Sep 17, 2013·5 cites·20 claims
- 0368US8852986B2Integrated circuit package system employing resilient member mold system technologyKUAN HEAP HOE·Filed 2007·Granted Oct 7, 2014·5 cites·12 claims
- 0467US8642382B2Integrated circuit packaging system with support structure and method of manufacture thereofKUAN HEAP HOE·Filed 2011·Granted Feb 4, 2014·2 cites·8 claims
- 0567US8124455B2Wafer strength reinforcement system for ultra thin wafer thinningKUAN HEAP HOE·Filed 2005·Granted Feb 28, 2012·2 cites·20 claims
- 0663US8334150B2Wafer level laser marking system for ultra-thin wafers using support tapeKUAN HEAP HOE·Filed 2005·Granted Dec 18, 2012·1 cites·20 claims
- 0762US8513542B2Integrated circuit leaded stacked package systemKUAN HEAP HOE·Filed 2006·Granted Aug 20, 2013·2 cites·13 claims
- 0861US8409921B2Integrated circuit package system including honeycomb moldingKUAN HEAP HOE·Filed 2010·Granted Apr 2, 2013·1 cites·20 claims
- 0949US8487434B2Integrated circuit package system with redistribution layer and method for manufacturing thereofKUAN HEAP HOE·Filed 2010·Granted Jul 16, 2013·0 cites·16 claims
- 1047US8592286B2Ultra-thin wafer system and method of manufacture thereofKUAN HEAP HOE·Filed 2005·Granted Nov 26, 2013·0 cites·11 claims
- 1146US2009243068A1Integrated circuit package system with non-symmetrical support structuresKUAN HEAP HOE·Filed 2008·Application pending·0 cites
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