Assignee
KULICKE & SOFFA HOLDINGS INC
US·10 granted patents·445 citations·filing 1998–2001
Top patents by PatentIndex Score
10 records- 0195US6586682B2Printed wiring board with controlled line impedanceKULICKE & SOFFA HOLDINGS INC·Filed 2000·Granted Jul 1, 2003·119 cites·21 claims
- 0282US6548224B1Wiring substrate features having controlled sidewall profilesKULICKE & SOFFA HOLDINGS INC·Filed 2000·Granted Apr 15, 2003·34 cites·30 claims
- 0380US6323435B1Low-impedance high-density deposited-on-laminate structures having reduced stressKULICKE & SOFFA HOLDINGS INC·Filed 1999·Granted Nov 27, 2001·47 cites·18 claims
- 0478US6165892AMethod of planarizing thin film layers deposited over a common circuit baseKULICKE & SOFFA HOLDINGS INC·Filed 1998·Granted Dec 26, 2000·60 cites·21 claims
- 0577US6262579B1Method and structure for detecting open vias in high density interconnect substratesKULICKE & SOFFA HOLDINGS INC·Filed 1998·Granted Jul 17, 2001·59 cites·27 claims
- 0676US6509529B2Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatchKULICKE & SOFFA HOLDINGS INC·Filed 2001·Granted Jan 21, 2003·17 cites·16 claims
- 0770US6317331B1Wiring substrate with thermal insertKULICKE & SOFFA HOLDINGS INC·Filed 1999·Granted Nov 13, 2001·37 cites·14 claims
- 0867US6440641B1Deposited thin film build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substratesKULICKE & SOFFA HOLDINGS INC·Filed 1998·Granted Aug 27, 2002·29 cites·30 claims
- 0961US6203967B1Method for controlling stress in thin film layers deposited over a high density interconnect common circuit baseKULICKE & SOFFA HOLDINGS INC·Filed 1998·Granted Mar 20, 2001·29 cites·18 claims
- 1055US6299053B1Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatchKULICKE & SOFFA HOLDINGS INC·Filed 1999·Granted Oct 9, 2001·14 cites·4 claims
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