Assignee
KULICKE & SOFFA IND INC
US·192 granted patents·45 pending applications·3,104 citations·filing 1976–2025
Top patents by PatentIndex Score
237 records- 0198US4441205APattern recognition systemKULICKE & SOFFA IND INC·Filed 1981·Granted Apr 3, 1984·198 cites·37 claims
- 0296US11364565B2Ultrasonic welding systems and methods of using the sameKULICKE & SOFFA IND INC·Filed 2020·Granted Jun 21, 2022·3 cites·12 claims
- 0396US11205633B2Methods of bonding of semiconductor elements to substrates, and related bonding systemsKULICKE & SOFFA IND INC·Filed 2020·Granted Dec 21, 2021·6 cites·18 claims
- 0496US5973504AProgrammable high-density electronic device testingKULICKE & SOFFA IND INC·Filed 1997·Granted Oct 26, 1999·136 cites·8 claims
- 0594US10882134B2Ultrasonic welding systems and methods of using the sameKULICKE & SOFFA IND INC·Filed 2018·Granted Jan 5, 2021·5 cites·10 claims
- 0694US7229906B2Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machineKULICKE & SOFFA IND INC·Filed 2002·Granted Jun 12, 2007·136 cites·20 claims
- 0793US9502371B2Methods of forming wire interconnect structuresKULICKE & SOFFA IND INC·Filed 2013·Granted Nov 22, 2016·14 cites·21 claims
- 0892US6908364B2Method and apparatus for probe tip cleaning and shaping padKULICKE & SOFFA IND INC·Filed 2001·Granted Jun 21, 2005·71 cites·18 claims
- 0991US11958124B2Ultrasonic welding systems and methods of using the sameKULICKE & SOFFA IND INC·Filed 2022·Granted Apr 16, 2024·2 cites·21 claims
- 1091US11937979B2Ultrasonic transducers, wire bonding machines including ultrasonic transducers, and related methodsKULICKE & SOFFA IND INC·Filed 2022·Granted Mar 26, 2024·2 cites·18 claims
- 1191US11850676B2Ultrasonic welding systems, methods of using the same, and related workpieces including welded conductive pinsKULICKE & SOFFA IND INC·Filed 2021·Granted Dec 26, 2023·3 cites·22 claims
- 1291US11597031B2Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methodsKULICKE & SOFFA IND INC·Filed 2021·Granted Mar 7, 2023·2 cites·34 claims
- 1391US11504800B2Ultrasonic welding systems and methods of using the sameKULICKE & SOFFA IND INC·Filed 2022·Granted Nov 22, 2022·2 cites·7 claims
- 1491US9576928B2Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the sameKULICKE & SOFFA IND INC·Filed 2016·Granted Feb 21, 2017·7 cites·26 claims
- 1591US4771930AApparatus for supplying uniform tail lengthsKULICKE & SOFFA IND INC·Filed 1986·Granted Sep 20, 1988·132 cites·16 claims
- 1691US4437604AMethod of making fine wire interconnectionsKULICKE & SOFFA IND INC·Filed 1982·Granted Mar 20, 1984·147 cites·4 claims
- 1791US4422568AMethod of making constant bonding wire tail lengthsKULICKE & SOFFA IND INC·Filed 1981·Granted Dec 27, 1983·147 cites·8 claims
- 1890US10861820B2Methods of bonding semiconductor elements to a substrate, including use of a reducing gas, and related bonding machinesKULICKE & SOFFA IND INC·Filed 2019·Granted Dec 8, 2020·7 cites·24 claims
- 1990US10381321B2Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the sameKULICKE & SOFFA IND INC·Filed 2018·Granted Aug 13, 2019·5 cites·19 claims
- 2090US4327860AMethod of making slack free wire interconnectionsKULICKE & SOFFA IND INC·Filed 1980·Granted May 4, 1982·163 cites·24 claims
- 2189US12370620B2Ultrasonic welding systems for conductive pins, and related methodsKULICKE & SOFFA IND INC·Filed 2024·Granted Jul 29, 2025·1 cites·13 claims
- 2289US6992001B1Screen print under-bump metalization (UBM) to produce low cost flip chip substrateKULICKE & SOFFA IND INC·Filed 2003·Granted Jan 31, 2006·55 cites·18 claims
- 2388US12070814B2Ultrasonic welding systems, methods of using the same, and related workpieces including welded conductive pinsKULICKE & SOFFA IND INC·Filed 2023·Granted Aug 27, 2024·1 cites·16 claims
- 2488US11776933B2Methods of bonding semiconductor elements to a substrate, including use of a reducing gas, and related bonding machinesKULICKE & SOFFA IND INC·Filed 2020·Granted Oct 3, 2023·2 cites·7 claims
- 2588US9093549B2Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the sameKULICKE & SOFFA IND INC·Filed 2014·Granted Jul 28, 2015·8 cites·30 claims
- 2688US4765531AQuick change work station apparatus for automatic wire bondersKULICKE & SOFFA IND INC·Filed 1987·Granted Aug 23, 1988·88 cites·15 claims
- 2787US4850780APre-peel die ejector apparatusKULICKE & SOFFA IND INC·Filed 1987·Granted Jul 25, 1989·94 cites·12 claims
- 2886US9425162B2Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the sameKULICKE & SOFFA IND INC·Filed 2015·Granted Aug 23, 2016·5 cites·14 claims
- 2986US9362247B2Systems and methods for bonding semiconductor elementsKULICKE & SOFFA IND INC·Filed 2015·Granted Jun 7, 2016·4 cites·54 claims
- 3086US7188759B2Methods for forming conductive bumps and wire loopsKULICKE & SOFFA IND INC·Filed 2005·Granted Mar 13, 2007·24 cites·20 claims
- 3186US4990051APre-peel die ejector apparatusKULICKE & SOFFA IND INC·Filed 1989·Granted Feb 5, 1991·85 cites·4 claims
- 3285US11728201B2Methods for releasing ultra-small or ultra-thin discrete components from a substrateKULICKE & SOFFA IND INC·Filed 2021·Granted Aug 15, 2023·1 cites·20 claims
- 3385US11462506B2Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the sameKULICKE & SOFFA IND INC·Filed 2021·Granted Oct 4, 2022·1 cites·21 claims
- 3485US4653681AVoice coil actuated fine wire clampKULICKE & SOFFA IND INC·Filed 1985·Granted Mar 31, 1987·99 cites·16 claims
- 3584US7584881B2Low loop height ball bonding method and apparatusKULICKE & SOFFA IND INC·Filed 2007·Granted Sep 8, 2009·12 cites·5 claims
- 3684US7500590B2Multi-part capillaryKULICKE & SOFFA IND INC·Filed 2007·Granted Mar 10, 2009·14 cites·24 claims
- 3784US4361261AApparatus for wire bondingKULICKE & SOFFA IND INC·Filed 1980·Granted Nov 30, 1982·67 cites·3 claims
- 3883US12183711B2Methods of determining a sequence for creating a plurality of wire loops in connection with a workpieceKULICKE & SOFFA IND INC·Filed 2023·Granted Dec 31, 2024·1 cites·28 claims
- 3983US9865560B2Methods of forming wire interconnect structuresKULICKE & SOFFA IND INC·Filed 2016·Granted Jan 9, 2018·3 cites·24 claims
- 4083US9478516B2Methods of operating bonding machines for bonding semiconductor elements, and bonding machinesKULICKE & SOFFA IND INC·Filed 2015·Granted Oct 25, 2016·4 cites·15 claims
- 4183US9136240B2Systems and methods for bonding semiconductor elementsKULICKE & SOFFA IND INC·Filed 2014·Granted Sep 15, 2015·4 cites·51 claims
- 4283US4586642AWire bond monitoring systemKULICKE & SOFFA IND INC·Filed 1985·Granted May 6, 1986·73 cites·11 claims
- 4382US12412772B2Setting up ultra-small or ultra-thin discrete components for easy assemblyKULICKE & SOFFA IND INC·Filed 2023·Granted Sep 9, 2025·0 cites·17 claims
- 4482US11581285B2Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machineKULICKE & SOFFA IND INC·Filed 2020·Granted Feb 14, 2023·2 cites·8 claims
- 4582US9810641B2Systems and methods for measuring physical characteristics of semiconductor device elements using structured lightKULICKE & SOFFA IND INC·Filed 2014·Granted Nov 7, 2017·7 cites·13 claims
- 4682US9426898B2Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assemblyKULICKE & SOFFA IND INC·Filed 2015·Granted Aug 23, 2016·4 cites·19 claims
- 4782US7464854B2Method and apparatus for forming a low profile wire loopKULICKE & SOFFA IND INC·Filed 2006·Granted Dec 16, 2008·13 cites·14 claims
- 4882US7160797B2Method of bumping die pads for wafer testingKULICKE & SOFFA IND INC·Filed 2005·Granted Jan 9, 2007·11 cites·18 claims
- 4982US4315128AElectrically heated bonding tool for the manufacture of semiconductor devicesKULICKE & SOFFA IND INC·Filed 1978·Granted Feb 9, 1982·65 cites·11 claims
- 5081US12266556B2Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding systemKULICKE & SOFFA IND INC·Filed 2023·Granted Apr 1, 2025·2 cites·19 claims
Showing the top 50 of 237 patent records by PatentIndex Score.
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