Assignee
KUO CHEN-CHENG
TW·7 granted patents·162 citations·filing 2007–2012
Top patents by PatentIndex Score
7 records- 0199US8227902B2Structures for preventing cross-talk between through-silicon vias and integrated circuitsKUO CHEN-CHENG·Filed 2007·Granted Jul 24, 2012·136 cites·19 claims
- 0289US8659170B2Semiconductor device having conductive pads and a method of manufacturing the sameKUO CHEN-CHENG·Filed 2010·Granted Feb 25, 2014·9 cites·21 claims
- 0386US8598030B2Process for making conductive post with footing profileKUO CHEN-CHENG·Filed 2010·Granted Dec 3, 2013·7 cites·19 claims
- 0480US8604594B2Structures for preventing cross-talk between through-silicon vias and integrated circuitsKUO CHEN-CHENG·Filed 2012·Granted Dec 10, 2013·4 cites·19 claims
- 0579US9053989B2Elongated bump structure in semiconductor deviceKUO CHEN-CHENG·Filed 2011·Granted Jun 9, 2015·5 cites·20 claims
- 0661US8703609B2Through-substrate via for semiconductor deviceKUO CHEN-CHENG·Filed 2011·Granted Apr 22, 2014·1 cites·11 claims
- 0752US8456008B2Structure and process for the formation of TSVsKUO CHEN-CHENG·Filed 2011·Granted Jun 4, 2013·0 cites·20 claims
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