Assignee
KUO CHIH-MING
TW·4 granted patents·4 pending applications·16 citations·filing 2011–2012
Top patents by PatentIndex Score
8 records- 0184US8432017B2Method for fabricating a three-dimensional inductor carrier with metal core and structure thereofKUO CHIH-MING·Filed 2011·Granted Apr 30, 2013·8 cites·13 claims
- 0273US8415243B1Bumping process and structure thereofKUO CHIH-MING·Filed 2012·Granted Apr 9, 2013·4 cites·7 claims
- 0363US8704345B2Semiconductor package and lead frame thereofKUO CHIH-MING·Filed 2012·Granted Apr 22, 2014·2 cites·7 claims
- 0461US8450049B2Process for forming an anti-oxidant metal layer on an electronic deviceKUO CHIH-MING·Filed 2011·Granted May 28, 2013·2 cites·13 claims
- 0545US2014035125A1Semiconductor manufacturing method, semiconductor structure and package structure thereofKUO CHIH-MING·Filed 2012·Application pending·0 cites
- 0645US2014035126A1Semiconductor manufacturing method and semiconductor structure thereofKUO CHIH-MING·Filed 2012·Application pending·0 cites
- 0744US2013193570A1Bumping process and structure thereofKUO CHIH-MING·Filed 2012·Application pending·0 cites
- 0835US2013183823A1Bumping processKUO CHIH-MING·Filed 2012·Application pending·0 cites
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