Assignee
KUPRION INC
US·19 granted patents·14 pending applications·5 citations·filing 2015–2025
Top patents by PatentIndex Score
33 records- 0190US2026083775A1Antiseptic applications of metal nanoparticle agglomeratesKUPRION INC·Filed 2025·Application pending·0 cites
- 0288US2026027661A1High temperature solders and connections formed therefromKUPRION INC·Filed 2025·Application pending·0 cites
- 0384US10616994B2Thermal management in circuit board assembliesKUPRION INC·Filed 2019·Granted Apr 7, 2020·3 cites·17 claims
- 0482US12426148B2Thermal management in circuit board assembliesKUPRION INC·Filed 2024·Granted Sep 23, 2025·0 cites·23 claims
- 0580US11735548B2Electronics assemblies employing copper in multiple locationsKUPRION INC·Filed 2019·Granted Aug 22, 2023·2 cites·13 claims
- 0679US12230596B2Electronics assemblies employing copper in multiple locationsKUPRION INC·Filed 2023·Granted Feb 18, 2025·0 cites·18 claims
- 0778US2024292531A1Ceramic-based circuit board assemblies formed using metal nanoparticlesKUPRION INC·Filed 2024·Application pending·0 cites
- 0877US12447562B2Nanoparticle paste compositions and connections formed therefromKUPRION INC·Filed 2019·Granted Oct 21, 2025·0 cites·15 claims
- 0976US2025203753A1Thermal Management in Circuit Board AssembliesKUPRION INC·Filed 2025·Application pending·0 cites
- 1071US12514874B2Antiseptic applications of metal nanoparticle agglomeratesKUPRION INC·Filed 2021·Granted Jan 6, 2026·0 cites·14 claims
- 1171US11910520B2Thermal management in circuit board assembliesKUPRION INC·Filed 2021·Granted Feb 20, 2024·0 cites·25 claims
- 1271US11141785B2Metal nanoparticles formed around a nucleus and scalable processes for producing sameKUPRION INC·Filed 2020·Granted Oct 12, 2021·0 cites·9 claims
- 1371US2025157969A1Electronic assemblies employing copper in multiple locationsKUPRION INC·Filed 2025·Application pending·0 cites
- 1470US12091567B2Ink composition, method for forming a conductive member, and conductive deviceKUPRION INC·Filed 2022·Granted Sep 17, 2024·0 cites·25 claims
- 1567US12016118B2Ceramic-based circuit board assemblies formed using metal nanoparticlesKUPRION INC·Filed 2021·Granted Jun 18, 2024·0 cites·16 claims
- 1667US11503700B2Thermal management in circuit board assembliesKUPRION INC·Filed 2020·Granted Nov 15, 2022·0 cites·15 claims
- 1767US11417441B2Method of interconnecting nanowires, nanowire network and transparent conductive electrodeKUPRION INC·Filed 2020·Granted Aug 16, 2022·0 cites·10 claims
- 1867US10569329B2Metal nanoparticles formed around a nucleus and scalable processes for producing sameKUPRION INC·Filed 2017·Granted Feb 25, 2020·0 cites·4 claims
- 1965US12543807B2Garments, gloves and personal protective equipment enchanced with metal nanoparticle agglomeratesKUPRION INC·Filed 2021·Granted Feb 10, 2026·0 cites·11 claims
- 2064US11274224B2Ink composition, method for forming a conductive member, and conductive deviceKUPRION INC·Filed 2017·Granted Mar 15, 2022·0 cites·16 claims
- 2162US12595379B2Articles coated with metal nanoparticle agglomeratesKUPRION INC·Filed 2022·Granted Apr 7, 2026·0 cites·19 claims
- 2262US2025367728A1Platelet nanoparticles, compositions thereof, and formation thereofKUPRION INC·Filed 2023·Application pending·0 cites
- 2361US2024156102A1Biofilm-Resistant Articles Coated with Metal Nanoparticle AgglomeratesKUPRION INC·Filed 2022·Application pending·0 cites
- 2460US2026070312A1Deformable structures formed from metal nanoparticles and use thereof in heat transferKUPRION INC·Filed 2023·Application pending·0 cites
- 2557US10692621B2Method of interconnecting nanowires and transparent conductive electrodeKUPRION INC·Filed 2016·Granted Jun 23, 2020·0 cites·15 claims
- 2656US12357932B2Air filtration media having metal nanoparticle agglomerates adhered thereto, formation thereof and use thereofKUPRION INC·Filed 2021·Granted Jul 15, 2025·0 cites·16 claims
- 2756US2023172211A1Spray formulations comprising metal nanoparticle agglomerates and surface disinfection therewithKUPRION INC·Filed 2021·Application pending·0 cites
- 2855US2025185156A1Metal-coated substrates, interposers, and methods for production thereofKUPRION INC·Filed 2023·Application pending·0 cites
- 2954US2024422892A1Heat spreaders featuring coefficient of thermal expansion matching and heat dissipation using sameKUPRION INC·Filed 2022·Application pending·0 cites
- 3054US2023172292A1Protective coverings and dry wipes comprising metal nanoparticle agglomerates for infection control applications and formation and use thereofKUPRION INC·Filed 2021·Application pending·0 cites
- 3152US2024365510A1Heat Pipes Featuring Coefficient of Thermal Expansion Matching and Heat Dissipation Using SameKUPRION INC·Filed 2022·Application pending·0 cites
- 3249US10701804B2Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennasKUPRION INC·Filed 2015·Granted Jun 30, 2020·0 cites·17 claims
- 3349US2025159807A1Metallized vias in glass and silicon substrates, interposers, and methods for production thereofKUPRION INC·Filed 2023·Application pending·0 cites
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